层数:10
特殊工艺:金手指
表面处理:沉金
材料:中TG FR4
外层线宽/线距:4/4mil
内层线宽/线距:4/4mil
板厚:1.6mm
最小孔径:0.2mm
Product name: 10 Layer Medium TG Gold Finger PCB
Number of layers: 10
Surface finish: ENIG
Base material: Medium TG FR4
Outer Layer W/S: 4/4mil
Inner layer W/S: 4/4mil
Thickness: 1.6mm
Min. hole diameter: 0.2mm
Special process:gold finger