层数：4
特殊工艺：阻抗
表面处理：沉金
材料：FR4(TG170)
外层线宽/线距：4/3.5mil
内层线宽/线距：4/3.5mil
板厚：1.0mm
最小孔径：0.25mm
Product name: 4 Layer High TG Impedance Control Fine Pitch PCB
Number of layers: 4
Surface finish: ENIG
Base material: High TG FR4
Outer Layer W/S: 4/3.5mil
Inner layer W/S: 4/3.5mil
Thickness: 1.0mm
Min. hole diameter: 0.25mm
Special process: Impedance Control